Zoom V3 1612 Manual de usuario descargar pdf (Pagina 104)

BIT1612 10-Bit Digital Video Decoder with OSD and T-CON

10 Soldering Information

10.1 Reflow Soldering

The choice of heating method may be influenced by plastic QFP package). If infrared or vapor phase

heating is used and the package is not absolutely dry (less than 0.1% moisture content by weight),

vaporization of the small amount of moisture in them can cause cracking of the plastic body. Preheating is

necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C.

Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be

applied to the printed-circuit board by screen printing, stenciling or pressure-syringe dispensing before

package placement. Several methods exist for reflowing; for example, convection or convection/infrared

heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100

and 200 seconds depending on heating method.

Typical reflow peak temperatures range from 215 to 270 °C depending on solder paste material. The

top-surface temperature of the packages should preferable be kept below 245 °C for thick/large packages

(packages with a thickness 2.5 mm or wi≧ th a volume 350 mm≧

so called thick/large packages). The

top-surface temperature of the packages should preferable be kept below 260 °C for thin/small packages

(packages with a thickness < 2.5 mm and a volume < 350 mm

so called thin/small packages).

Stage Condition Duration

1’st Ram Up Rate max3.0+/-2 /sec℃ -

Preheat 150 ~200℃℃ 60~180 sec

2’nd Ram Up max3.0+/-2 /sec℃ -

Solder Joint 217 above℃ 60~150 sec

Peak Temp 260 +0/-5℃ 20~40 sec

Ram Down rate 6 /sec max℃ -

10.2 Wave Soldering

Conventional single wave soldering is not recommended for surface mount devices (SMDs) or

printed-circuit boards with a high component density, as solder bridging and non-wetting can present major

problems.

10.3 Manual Soldering

Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less)

soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C.

When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between

270 and 320 °C.

Time (sec)

Tem p (℃)

60~150

60~180

200

217

260

150

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Zoom V3 1612 Manual de usuario Pagina 104

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